概览

The μClamp3324P, part of the μClamp® series of products, is a solid-state device designed specifically for transient suppression. It is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over traditional pn junction processes.

封装

  • SLP2116P8

订购代码

  • uClamp3324P.TCT

PB Free/ROHS

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功能

  • 数据线路瞬变保护符合以下标准
    • IEC 61000-4-2 (ESD) ±15kV(空气),±8kV(接触)
    • IEC 61000-4-4 (EFT) 40 A (tp = 5/50ns)
  • Small package for use in portable electronics
  • Protects four I/O
  • 工作电压:3.3V
  • Flow thru design for easy layout
  • 小漏电流
  • Low operating and clamping voltages
  • 固态硅雪崩技术

应用

  • 蜂窝手机和配件
  • 个人数码助理 (PDA)
  • 笔记本电脑和手持设备
  • 便携式仪表
  • 数码相机
  • 外围设备
  • MP3 播放器

Inventory

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